Product Development » Nexx Systems

Nexx Systems is the leader in flip chip and advanced packaging. Their products are the most efficient yet affordable systems of their kind. ADM has had the pleasure of working with Nexx Systems for several years now. Thanks to the industry's positive recognition of the Stratus and Nimbus systems, their business relationship has turned into a mutually successful partnership.

Nexx Systems

Nexx hired ADM in 2003 to repackage and manufacture their Stratus and Nimbus systems.

The Stratus is the technology leader for:

• TSV (Through Silicon Via)
• Solder Bumping
• Copper pillar
• UBM and other advanced packaging applications

The Stratus has won many awards including Semiconductor Magazine's Best Product 2007. In January of 2010, Nexx celebrated the 100th system sold and awarded ADM for their commitment to performance and quality.

Click here for more information on the Stratus System

The Nimbus is a state of the art metal disposition for wafer level packaging applications. Some of its characteristics include:

• capable of running different wafer sizes without venting the process chamber
• combines many of the features and capabilities of advanced cluster tools with the low cost and simplicity of an in-line system

Click here for more information on the Nimbus System

Product Development » Nexx Systems